
| Category | Specific Specifications |
| Dimensions | Thickness: 25mm; |
| Field of View | 120°×25° (Urban Wide-Angle Mode) |
| Ranging Capability | Maximum up to 200m |
| Scanning Lines | 126 lines, equivalent 251 lines in ROI area |
| Angular Resolution | 0.1°×0.1° (ROI Area in Highway Telephoto Mode) |
| Core Chip | Self-developed SoC chip M-Core |
| Scanning Technology | 2D Scanning MEMS Chip Technology |
| Power Consumption | Below 10W |
| ROI Function | Globally Adjustable |
| Weak Echo Detection Capability | 4x improvement compared to previous generations |
| Equivalent Distance Resolution | 32x improvement compared to previous generations |
| Motherboard Area | Reduced by 50% compared to previous generations |
| PCBA Count | Reduced by 69% compared to M1 Plus |
| Optical Component Count | Reduced by 80% compared to M1 Plus |
| Deployment Methods | In-cabin (behind windshield, etc.); |
| NVH Performance | NVH-free, operating noise close to background noise |
Product Technical Features
(I) Chip-Integration: Balancing Performance and Cost
- Equipped with RoboSense’s fully self-developed SoC chip M-Core, integrating a quad-core 64bit APU + dual-core MCU, with a main frequency of 1GHz and 8MByte on-chip storage unit, delivering powerful computing and processing capabilities.
- Integrates multi-threshold TDC (Time-to-Digital Converter), increasing weak echo detection capability by 4x and equivalent distance resolution by 32x.
- Breakthrough integration of the entire backend circuit into a single chip, reducing motherboard area by 50%, power consumption by 40%, and significantly lowering costs.
- Adopts the mature 2D scanning MEMS chip from the M platform, realizing chipization of the scanning module. No mechanical motor vibration inside ensures stable operation throughout the entire lifecycle.
- Upgrades the transceiver system of the M platform, optimizing the performance of transceiver chips to further improve perception accuracy and reliability.
(II) Extreme Design: Ultra-Slim, Flexible, and Easy to Deploy
- Redefines the main LiDAR standard with an ultra-slim 25mm thickness. Compared with M1/M1 Plus/M2, the volume is reduced by 40%, thickness by 44%, and the exposed window area by 80%.
- Extreme architectural integration: PCBA count reduced by 69%, optical component count by 80%. Highly compatible with the overall vehicle design, it can be flexibly installed behind the windshield, on the roof, in the headlights, and in the grille.
- Exterior deployment enables integrated roof integration with ultra-low wind resistance; in-cabin deployment requires only a minimal KOZ (Keep Out Zone: the space occupied by sensors integrated on the windshield), ensuring “zero” obstruction to the driver’s view.
- Operating power consumption is below 10W, featuring energy-saving and long-lasting advantages, with significantly improved manufacturability.
(III) Intelligent Perception: Full-Scenario Adaptation for Enhanced Safety
- The ROI function achieves a leap from “single-dimensional adjustable” to “globally adjustable”, adapting to diverse driving scenarios such as urban areas and highways.
- Urban wide-angle mode offers a 120°×25° wide field of view, enabling insight into surrounding traffic dynamics and smoothly handling complex scenarios such as unprotected left turns, U-turns, and lane changes at busy urban intersections.
- In highway telephoto mode, the ROI area has an equivalent 251 lines and an angular resolution of 0.1°×0.1°, which can focus on scanning the distant front of the road. The maximum ranging distance of 200m allows the vehicle to detect distant obstacles in advance.
- NVH-free (Noise, Vibration, and Harshness) design, with operating noise extremely close to background noise, maintaining a quiet and premium driving experience.
(IV) Platform-Based Iteration: Seamless Upgrade with Low Cost
- 100% inherits the 2D scanning architecture, core optical path, and optoelectronic components of the M platform, reusing M platform production line equipment, resulting in high product maturity and an extremely short development cycle.
- Continues the platform-based and modular design. Subsequent iterative products can achieve pin-to-pin upgrades of core components, maintaining consistent point cloud scanning patterns and data interfaces.
- The secondary development cost is nearly “zero”, helping customers continuously optimize the intelligent driving performance of new vehicle models, realizing generational performance upgrades and cost reductions.








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